Used SPTS Multiplex ASE ICP #9158122 for sale

SPTS Multiplex ASE ICP is a plasma etcher/asher from the Multiplex ASE series of products offered by SPTS Technologies Ltd. Based out of Europe and having amassed many years of expertise in the etch and deposition industry, SPTS offers a full-featured toolset for plasma etching and ashing of semiconductor substrates. Multiplex ASE ICP is an inductively-coupled plasma (ICP) asher/etcher featuring a unique compact design which utilizes the latest in single chamber RF and ICP source technology. The product is capable of performing complex etch/ash processes on multiple substrates simultaneously at process temperatures of up to 400 ºC. The tool is also equipped with a proprietary quench and purge equipment and ancryogenic system designed to minimize water condensation and provide a superior ashing process. SPTS Multiplex ASE ICP is an ideal tool for 2D and 3D device structures as well as ultra-shallow junction (USJ) processes. Its ICP source offers excellent etching/ashing uniformity and process repeatability, allowing for high throughput and repeatable results. The RF source is complete with an auto-tune unit that eliminates tuning and frequency optimization time. This machine also ensures stable and consistent etching/ashing while minimizing exposure of the substrate to RF energy. The ICP source and RF source of Multiplex ASE ICP can be configured with precision to allow for the optimization of difficult etching/ashing processes. The toolset also features advanced pressure and temperature control, enabling it to deliver precise process control over substrate material properties and process uniformity. SPTS Multiplex ASE ICP has a wide range of features that provide a wide range of etch/ash applications. It has a high-density chuck top coating that is capable of high-density ICCD etch processes and the tool is also capable of etching/ashing some of the most challenging metals such as tungsten, TiN, copper oxide, Mo, and Co. This advanced toolset also provides a flexible match of process times, allowing users to customize their processing workflows to their specific needs. Overall, Multiplex ASE ICP is a powerful, compact, and versatile toolset that offers users the capability to etch/ash a wide range of different substrate materials and perform complex etching processes on multiple substrates simultaneously. Its advanced process control systems and precise etching parameters make it an ideal tool for 2D and 3D device structures as well as ultra-shallow junction (USJ) processes.