Used SPTS Omega FXP #9192160 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 9192160
Wafer Size: 6"-8"
Rapier plasma etch system, 6"-8"
fxP Wafer transport module
DSi Rapier process module
Multi-chamber system
Configuration:
4-Color alarm tower
Bracket-mounted high resolution color
Through wall panel
PC104 Control architecture
Devicenet control module:
Pendulum valve
MFCs
Pneumatics
Fore-line convectron
Thermocouples
Cable to electronics rack: 10m
Electronics cabinet
fxP Transport module:
8-Port wafer transport module
BROOKS AUTOMATION MagnaTran 7 series robot
(2) Vacuum cassettes
Dynamic wafer aligner
DSi Rapier process module:
BOSCH Process deep Si module
Rapier plasma source
Module envelope: Process control hardware
PC104 Control unit
Primary / Secondary source: (4) ADVANCED ENERGY Apex RF generators
High / Low frequency: ADVANCED ENERGY Apex RF generator (Bias)
RF Bias match
Top power fixed match
DC Coil supply
Heated VAT pendulum valve
Electro-static chuck
PSU & He back-pressure control
Heated lower chamber
DSi Upper chamber & foreline
Extracted surface mount gas boxes (1x Primary, 1 x Secondary)
ALCATEL ATH2300MT Turbo pump
Automated He flow endpoint
Turbo by-pass for module roughing
Chamber capacitance manometer (1.0 torr)
Foreline mini-capacitance manometer
Wafer edge protection ring
Perfluoroelastomer seals
Options: Claritas optical endpoint system
Ancillary equipment:
BETTATECH CU700 Re-circulating chiller
ADIXEN ADP122LM
ADIXEN ADS602H
NESLAB ThermoFlex 24000 Chiller
CLARITAS Optical endpoint system
Includes:
(2) Manuals CD
Conversion kit, 8"
Rear control station
2012 vintage.
SPTS Omega FXP etcher is a state-of-the-art ashing equipment designed for advanced surface micromachining applications. It is capable of processing variety of substrates such as silicon, silicon dioxide, or titanium nitride with excellent layer uniformity and particle control. SPTS OMEGA FXP etcher includes a combination of mechanical, chemical, and plasma processes to deliver precise and uniform ashing of a variety of thin film materials. These magnetic and/or electrostatic processes are highly accurate and can be used to etch 3D surfaces or flat-bottom, thin layers. The etcher includes an X,Y,Z motion system and a radio frequency (RF) coil. The X,Y ,Z motion unit enables the mechanically adjustable stage and offers a high repeatability, while the RF coil offers excellent precision and depth depending on the substrate type. Omega FXP etcher implements a strong dual directional etch. It uses a two-step, sequential process that first cuts away the substrate material layer-by-layer and then deposits a thin, uniform oxide layer that evens out irregularities. This dual directional etching process helps minimize the recast of laser ablated carbon sources. SPTS-OMEGA FXP is equipped with a gas injection machine which enables precise gas dosing, depending on the size of the substrate. The tool is able to reach up to 400 mbar of oxygen pressure and a partial oxygen flow that is adjustable from 25 to 30 slm. This helps ensure optimal removal of material while minimizing debris build-up inside the chamber. The etcher features a plasma-enhanced etching standard and a plasma-enhanced oxidation process. The plasma-enhanced etch is a high-energy, low- pressure process which is capable of removing overetch layers inside 0.3 microns with great accuracy and surface uniformity. The plasma-enhanced oxidation increases the oxygen sticking coefficient, which improves the ashing process. This helps reduce the time dramatically. SPTS-SPTS Omega FXP etcher is versatile, easy to operate, and offers flexible and customizable parameters, helping to pave the way for advanced technologies in micromachining. Its combination of high precision, large throughput, and cleanliness helps deliver a top-notch product in an efficient and cost effective manner.
There are no reviews yet