Used STS / CPX Multiplex ASE ICP #9147808 for sale

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STS / CPX Multiplex ASE ICP
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ID: 9147808
Wafer Size: 6"
Etcher, 6".
STS / CPX Multiplex ASE ICP (Inductively Coupled Plasma) is an etcher/asher used in the production and fabrication of integrated circuit chips (ICs) and other microelectronic devices or components. It is a high-precision, micro-fabrication tool used to create ultra-fine features on semiconductor surfaces, such as copper or gold heat sinks. STS Multiplex ASE ICP works by ionizing a suitable gas inside a vacuum chamber or process chamber. This gas is ionized through induction within the chamber, which creates a plasma from the gas particles. This plasma is then used to etch or "etch away" small precise features from the target substrate. The ICP technology can be used for a variety of applications that include: precise patterning of elements on a semiconductor surface, planarization of vias and contacts in segmented structures, etch-back of insulator layers, and precise copper seed layer patterning. CPX Multiplex ASE ICP has a wide range of characteristics, making it an attractive etcher/asher choice in many microfabrication processes. This etcher has high production accuracy with a single wafer etch back rate of up to 500 nm per second with 0.25 μm of resolution. It is equipped with a highly precise, multi-axis scanning equipment with a 16-bit programmable resolution, which allows for precise feature patterning in both x-y and z-axes for complex geometries. The tool has compatibility with a variety of wafer sizes and materials, including quartz, silicon, aluminum, and GaAs substrates. Furthermore, it is also equipped with a vacuum sharpening system, which allows for an accurate etch process with minimized process time. This makes Multiplex ASE ICP an ideal choice for high-performance and high-throughput batch processes. In conclusion, STS / CPX Multiplex ASE ICP is a high-precision tool capable of achieving high-precision feature etching and ashing. Its wide range of features and application compatibility make it a desirable choice for many semiconductor fabrication processes. Its highly precise scanning unit and vacuum sharpening machine are also key features that make this tool a reliable and efficient choice for microfabrication procedures.
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