Used STS / CPX Multiplex ICP #9165960 for sale

STS / CPX Multiplex ICP etcher/asher is a reliable and cost-effective tool for a variety of industrial applications. This machine is highly accurate and is used for layers of small-geometry features in RF plasmas. The equipment provides up to 8-axis fully integrated substrate handling that can sequentially etch, ash, and process materials of different shapes and sizes. STS Multiplex ICP etch/ash machine utilizes a highly effective, advanced ion-generation process and technology, which results in excellent process uniformity and reduced processing cost. This system utilizes a proprietary, meandering-type, shutterless source for controllable etch profiles along with superior uniformity control. Multiple sources can be utilized in the same process module. The advanced etch/ash process includes components such as the control unit, the load locks, chambers, RF generator, and the optional Robot arm module. The control machine includes the tool, PROM programming and maintenance software, and an onboard process monitoring asset. The load locks incorporate dual role chambers capable of etch/ash applications in different chamber configurations. CPX Multiplex ICP etch/ash machine has a flexible process control with an adjustable low-pressure plasma source for etching a variety of materials. The etching process is based on the control of independent variable parameters such as frequency, power, and gas production. The RF power generator provides precise, controlled, and repeatable performance. This machine offers optimum RF frequency selection for exact repeatability of etch and ash steps in order to create perfect structures. The SRF power can be monitored and adjusted in real time. The optional robot arm module provides automated movement of substrates to and from the load/unload locks. The motion of the arm can be programmed to increase accuracy and reduce down time. The model has an automatic chamber venting procedure for improved safety and convenience. The etching process includes platen plasma pre-treatment, ion exposed conditioning, and sputter precleaning. Multiplex ICP etch/ash machine is an excellent choice for precise control of small geometry features in radio frequency plasmas. This etcher/asher offers excellent durability and low cost. It is a reliable, efficient, and cost-effective machine for a variety of manufacturing applications.