Used STS / CPX Multiplex #9162410 for sale

Manufacturer
STS / CPX
Model
Multiplex
ID: 9162410
Wafer Size: 4"
Vintage: 2002
ICP AOE system, 4" Load lock Previously used for oxide, pyrex, quartz etching Process gases plumbed: C3F8, C4F8, SF6, CF4, Cl2, C2H4, O2, H2, Ar, He (2) Affinity chillers Chiller 1: RAA-005J-CE01CBD Chiller 2: PWG-060K-BE33CBC2 Chuck: Mechanical clamp LEYBOLD MAG 2000 CT turbo pump MAG drive 2000 turbo controller EDWARDS IQDP80 Dry pump EDWARDS D40BCS Oil pump MILLIPORE CDLD 1112E HE cooling manometer ENI ACG-10B RF generator AE RFG 3001 RF generator Finger and ceramic ring has broken 208 V, 60 Hz, 3 phase, 80 A Missing part: Gas box 2002 vintage.
STS / CPX Multiplex etcher/asher is an automated equipment for etching and ashing of wafers. It is designed to asher and etch up to eight wafers simultaneously in one operation for high productivity, throughput and cost-effectiveness. STS is built with a stainless steel chamber to provide a stable environment and ensure longer operational life. It has a high-temperature furnace that is capable of reaching temperatures up to 1300°C, and is ideal for etching and ashing silicon and other materials. The system also has increased capabilities for adjusting process parameters, such as temperature, process time, and gas flow rate. The ashing/etching process can be preset for each recipe and monitored during runtime. CPX has advanced process controls, including automated time-sequencing, temperature ramp profiling, and process set-point management. This allows the user to precisely control process parameters such as flow rate, temperature set-point, and cycle time. The ability to program a variety of thermal and temperature profiles for both etching and ashing makes it one of the most versatile etching/ashing systems available. STS / CPX utilizes an advanced monitoring unit for controlling both ashing and etching processes. This includes real-time sensing of chamber pressure, display of the wafer states, automatic calibration & adjustment of pressure for optimal ashing/etching performance, and direct control access for the etching/ashing process. Providing maximum temperature uniformity, the machine also has a unique design of the wafer handling tool that ensures good temperature homogeneity throughout all the wafers in the chamber. This asset is equipped with computer-controlled lift/positioning for the wafers, and optional manual lift/positioning. Overall, STS Multiplex etcher/asher is an excellent choice for high-efficiency, high-throughput wafer etching and ashing. With its advanced process controls, precise parameters, and uniform temperatures, it is ideal for efficient and reliable production.
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