Used TEGAL 211 #114351 for sale

Manufacturer
TEGAL
Model
211
ID: 114351
Wafer Size: 3"
Etcher / Asher, 3" Table top Aluminum chamber ID: 3.5" H x 6" W x 7" D With timer 0-99 minutes Direct drive pump
TEGAL 211 is a high-performance plasma etcher and asher. It is a fully automated, single-wafer equipment and is engineered for the precision control and uniformity of etching processes to ensure the highest levels of accuracy over long production cycles. The primary component of the system is its high powered, single stage turbo pump, which serves as the pressure control unit ensuring an accurate and consistent etch across the wafer. The floating dome etch chamber, which is separate from the pump, improves uniformity and produces high etch rates with low profile height and sidewall angles. The wafer processing temperature is also precisely controlled and the chamber is capable of achieving temperatures of up to 700°C. 211 also features TEGAL 211, multi-function RF Power Machine which allows for stable, high-performance processing with repeatable results. This power tool supports high-density, low acceleration plasma for improved high aspect ratio etching. The asset can be tuned for optimal uniformity, etch rate, and etch selectivity. The precision of 211 is further enabled by its comprehensive suite of measurement tools and control systems, which includes auto alignment, auto focus, and plasma gas control for accurate process repeatability, as well as its advanced detection systems for sub-surface damage, edge effects, and lifetime management. The model also offers an intuitive, platform-based graphical user interface with process control and management features. This allows users to store process recipes, monitor etching parameters, and take advantage of the efficiency of batch processing. TEGAL 211 is ideal for a variety of applications, including half micron or smaller photomask fabrication, dielectric and metallic etching, series linear metal mesa etching, nanowire etching, semiconductor device fabrication, metal implantation, data storage, and dry-wafer cleaning.
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