Used BSL / BETA SQUARED LITHOGRAPHY PE 700 #9157841 for sale

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BSL / BETA SQUARED LITHOGRAPHY PE 700
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ID: 9157841
Wafer Size: 6"
Aligners, 6".
BSL / BETA SQUARED LITHOGRAPHY PE 700 is a state-of-the-art mask aligner designed for lithography applications. It provides a high-performance lithography solution for patterning high resolution features on semiconductor devices. The equipment is ideal for semiconductor device fabrication, fine patterning, and advanced packaging. BSL PE 700 mask aligner is a high-precision, mask aligner that has a compact design. It utilizes extreme ultraviolet lithography technology and provides an advanced exposure system for fine line patterns. This unit is capable of producing critical features as low as 30 nm in size with a high resolution output of 18 µm. It also has a high throughput of approximately 500 wafers per hour. The machine is equipped with a high-precision, motorized 5-axis stage, which offers excellent alignment accuracy and repeatability. In addition, the stage is capable of performing bulk alignment of multiple wafer sizes with a wide range of substrates. The wafer can be held securely without distortion or deformation of the pattern. The tool also features an automated software-driven lithography process and provides a high resolution image at critical levels. It allows users to develop a variety of photomasks from low to high complexity. The photomask is then mounted and exposed on the device with high accuracy to produce the desired pattern. The alignment accuracy coupled with the high resolution makes the asset an ideal choice for high precision and reliable lithography applications. BETA SQUARED LITHOGRAPHY PE 700 mask aligner also includes a post-exposure baking model. This ensures the pattern is properly baked with consistency. It also has an automated equipment to measure the end result and provide feedback to improve the alignment and accuracy of the next exposure. This makes it easy to optimize the results and maintain consistent yield. In summary, PE 700 is a high-resolution, mask aligner that is designed for use in high end lithography applications and semiconductor device fabrication. It provides an efficient and precise lithography solution for patterning high resolution features on semiconductor devices. This system is capable of patterning features as small as 30 nm with an impressive throughput of 500 wafers per hour. The automated software-driven lithography unit and the post-exposure baking machine make it an ideal choice for precise and reliable lithography results.
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