Used EVG / EV GROUP 620 #9165257 for sale

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Manufacturer
EVG / EV GROUP
Model
620
ID: 9165257
Vintage: 2008
Mask aligner, 4" BSA Lamphouse: 500W Automatic filter exchanger Conversion kit: 6" 2008 vintage.
EVG / EV GROUP 620 mask aligner is a powerful tool used to produce high-precision masks for critical semiconductor fabrication processing. EVG 620 utilizes precision 5-axis stages, advanced linear motors, and a hybrid air/water-cooling equipment to facilitate reliable, accurate alignment and processing of substrates up to 300mm in diameter. EV GROUP 620 integrated circuit (IC) die-bonding alignment system ensures high-precision, cost effective, and repeatable lithography results. It enables flexible placement and counts with a 10mm Z-wobble for perfect alignment of any IC die size. Furthermore, its motion control unit ensures excellent medium deflection performance for high-speed, precise alignment of wafers and substrates with an accuracy of 10 micron. The two high resolution cameras with zoom optics and internal filters are used for high-precision wafer alignment verification. The camera has a 12x or 8x overall zoom, with a minimum feature size detection of 30 micron for both un-patterned and patterned substrates. 620 has a programmable menu-driven wafer alignment machine which allows for easy setup and programming of all operating parameters. There is also an auto-calibration feature which allows for easy tracking of dimensional changes from the substrate during the mask alignment process. The tool supports both positive and negative image alignment, and provides a fast auto-focusing capability. The adjustable illumination module with a uniform field of light eliminates dark/bright spots and ensures a minimal 0.05° tilt error for the easiest and most effective alignment. EVG / EV GROUP 620 mask aligner is an essential tool for semiconductor fabrication processes that require high precision and repeatability. Its powerful motion control asset, advanced imaging technologies, and programmable alignment parameters ensure unmatched accuracy when processing large-scale substrates.
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