Used ACCRETECH / TSK W-GM-3000 #9055785 for sale

ACCRETECH / TSK W-GM-3000 is a fully automated wafer grinding, lapping and polishing equipment designed for deep thinning and high uniformity of semiconductor wafers. The system is capable of grinding, lapping, and polishing to a precise degree of accuracy as well as to achieve a grinding and polishing process in a cycle that is shorter than market standard. The unit is capable of grinding and polishing up to a wafer thickness of less than 10µm in a single process without additional post-grinding operations. The machine comes with a dual-wheel floor head, equipped with two abrasive wheels of 200mm in diameter with an operating pressure range of 0.1 kg/cm² to 1.5 kg/cm² to ensure balanced grinding operations. The tool also combines a two-axis grinding head with a four-axis polishing head for precise polishing and lapping operations. It also has a 3-axis auto stage for the precise positioning of the wafer for grinding and polishing operations. TSK W-GM-3000 offers advanced, automatic lapping processes with a patented modular diamond dispersion plate asset and a maximum processing area of 9'x17' for efficient wafer grinding and polishing. Furthermore, the model is equipped with a high precision, modern grinding/polishing control equipment for controlling the entire process, along with an integrated, laser-interferometer-suite for monitoring. The system can also handle wafers up to 300mm in diameter. The robust, compact design, high grinding accuracy and flexibility make ACCRETECH W-GM 3000 one-of-a-kind in the wafer processing industry.