Used NANOMETRICS NanoSpec M-210 #121797 for sale

NANOMETRICS NanoSpec M-210 is a high-precision mask and wafer inspection equipment designed for the automated process control and assessment of semi-conductor components. The system is equipped with a bright-field optical microscope and a broad array of illumination sources, detectors and photomultiplier tubes. It can be used to measure a wide range of imaging properties including wafer surface topography and critical dimensions, junction depth, defects and contamination. The unit consists of two stages: the Mask Stage and the Wafer Stage. At the Mask Stage, the machine performs dark field illumination of the mask to achieve a contrast between lines and space and precisely measure critical dimensions. The tool also performs white-light cross-sectional microscopy to accurately detect defects including line-width roughness, form and shape details and other defects such as particle deposition and wafer warpage. At the Wafer Stage, the asset performs bright field microscopy at higher resolutions to analyze the wafer profile and precisely measure critical dimensions down to nanometer scale. NanoSpec M-210 features several features to facilitate operation, including a deformable mirror for focus controlled high-resolution imaging, dual piezo driven stages for precise alignments, and automatic feature recognition for the automated classification of defects. In addition, the model offers a broad range of automated metrology features such as profiles, edge detections, and 2D/3D visualizations. Additionally, the equipment provides an array of advanced data analysis techniques to perform topography measurements, defect densities and uniformity inspections, as well as to identify trends and validate process results. NANOMETRICS NanoSpec M-210 is a reliable, robust and cost-effective combination of optical and electronic components, enabling highly precise and repeatable results in a compact form factor. It is ideal for use in the semiconductor industry, where processes require critical and consistent analysis of the different layers and components of a device. The system is capable of measuring very small details with high precision and accuracy, eliminating the need for manual inspection.