Used RINCO DYNAMIC 745 #9140377 for sale

RINCO DYNAMIC 745 is a equipment designed to reduce the time and cost associated with wafer processing. The system utilizes a comprehensive approach to reduce motion time and maximize productivity. DYNAMIC 745 integrates a high-precision motion control unit, precision motor control and patented acceleration/deceleration technology to process wafers more accurately and efficiently. The unit features a number of advanced features, including: A high-precision spindle motor for wafer processing that is capable of positioning wafers from the top to a maximum rate of 600mm/min and can achieve a maximum acceleration of 6.7G. The direct drive spindle motor provides the ability to quickly adjust the spindle position and to understand quickly which areas on the wafer require more work. RINCO DYNAMIC 745 has a patented acceleration/ deceleration machine that allows users to quickly adjust the velocity of the tool to deal with unexpected changes in process parameters. It also has the ability to process wafers with laser and blade technology, manual and automated wafer positioning systems and a patented wafer chuck locking asset. DYNAMIC 745 has a patented non-contact wafer centering model that automatically centers wafers on the chuck, eliminating the possibility of catastrophic damage due to improper positioning. The equipment also features an automated wafer chuck cleaning cycle which reduces process time and minimizes the need for operator intervention. The system can be equipped with a variety of accessories, such as UV laser marking systems, air bearings, ion channels and gas contamination systems. The unit is also equipped with a range of safety features, such as automatic stops and guards to protect operators from potential hazards. RINCO DYNAMIC 745 is a powerful and efficient wafer processing machine that is capable of meeting the demands of modern wafer fabrication factories. The tool provides an ideal solution for users looking for a fast, accurate and cost effective solution for their wafers processing needs.