Used AG ASSOCIATES Heatpulse 410 #9148956 for sale

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ID: 9148956
Wafer Size: 2"-4"
Rapid thermal processor, 2"-4" Quartz process chamber (21) Tungsten halogen lamps Closed-loop temperature control Fast heating and cooling rates Temperature range: 400-1250° C Steady-state temperature stability: ± 2° C Temperature monitoring mechanisms: Extended range pyrometer (ERP) Heating rate: 1-200° C/sec Cooling rate: max 150° C/sec Maximum non-uniformity: ±5°C across a 6″ wafer at 1150°C Implant: 1E16 50 KeV Implant uniformity ≤0.3% Steady state time: 1-9999 sec Process gases: Optional MFC, Up to 4.
AG ASSOCIATES Heatpulse 410 Rapid Thermal Processor is a state-of-the-art machine used for the fabrication of integrated circuits and other devices. Heatpulse 410 is designed to provide rapid and reliable thermocycling of semiconductor substrates in a tightly controlled and repeatable environment. At the heart of AG ASSOCIATES Heatpulse 410 is a highly advanced corrosion-resistant, high-speed microprocessor designed to provide accurate and rapid thermal cycles. This processor ensures minimal thermal gradients across the wafer, even when ramping up or down. The processor is designed to achieve high-accuracy temperature control and excellent cycle repeatability. Heatpulse 410 incorporates advanced RF protection to minimize thermal stress caused by signal interferences. It also features advanced ultra-low electrical noise levels to minimize potential interference with outside signals and crosstalk. AG ASSOCIATES Heatpulse 410 includes an on-board touch screen control panel with dedicated temperature, pulsing, and chamber temperature control modulators. It also features real-time thermal monitoring that provides the user with a continuous readout of individual wafer parameters such as temperature, pressure, and pulse width. Heatpulse 410 is designed to support both single-wafer and batch processing. It includes multiple embedded thermal profiles which allow users to configure the machine to accommodate different types of processing. Additionally, the machine can be configured to accommodate different thermal process requirements such as maximum heating rate, maximum cooling rate, and maximum soak time. In terms of safety, AG ASSOCIATES Heatpulse 410 is built with advanced safety features such as high temperature sensors and fail-safe power management to protect the machine from hardware and software faults. The machine also features a multi-point cooling system that can be used to cool the wafer in case of an emergency. Overall, Heatpulse 410 is an advanced and reliable rapid thermal processor designed to provide tight temperature control and excellent repeatability. It features a highly advanced microprocessor, reliable RF protection, and real-time thermal monitoring. Additionally, it includes various safety features such as high temperature sensors, fail-safe power management, and a multi-point cooling system.
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