Used AMAT / APPLIED MATERIALS P5000 Mark II #9023531 for sale

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ID: 9023531
Wafer Size: 8"
Vintage: 1995
CVD System, 8" Process: SIH4-Pe Oxide Process chambers: Basic CVD (3) chambers (A, B, C) (3) Chambers hardware Storage elevator: 28 Slots Nitride Main body Cassette indexer, 8" Cassette handler: Clamp type, 8" Load lock: Robot mechanism, 8" (3) Slit doors assy Pumping port assy Process chamber: (2) Susceptors nitride, 8" (3) Lift hoops assy (3) Susceptors lift assy (3) Wafer lift assy (3) Process chambers body, 8" (3) RF Match assy (3) Throttle valves assy dual spring (3) Gate valves assy (3) Lamp modules Gas panel: (3) Gas lines (3) Chambers NH3 200 SCCM N2 100 SCCM C3F8 300 SCCM N2O 800/2500 SCCM N2 5 SLM SIH4 200 SCCM Remote AC / RF Rack MFC: Qty / Make / Model (2) / UNIT / UFC 1660 (12) / UNIT / UFC 8160 (1) / UNIT / UFC 8161 (2) / SAM / SFC 1480 FPD (1) / SAM / SFC 1481 FPD Remote AC rack: (3) RF Coaxial cables Signal cable (3) NPM-1250C RF Matchers Minicontroller HT-200 Heat exchanger Missing parts: Qty / Part number / Description (1) / 0100-09002 / SBC (1) / 0100-09003 / VGA (1) / 0100-11001 / A/O (1) / 0660-01080 / HDD SCSI (1) / 0010-10636 / P-Chuck, 8" (2) / 0010-30406 / Throttle valves (3) / 0020–10123 / Plates perf narrow gap nitride, 8" (3) / 0020–10191 / Plate blockers nitride / TEOS USG, 8" (3) / 0020–10402 / Pumping plates, 8" TEOS / Sil oxide / Narrow gap sil / Nit (3) / 0200–09072 / Shields, 8" (3) / 0200–09075 / Adaptor pump plates, 8" narrow gap nitride / WB (12) / 0200-10074 / Lift pins, 8" (1) / 0010-76005 / Robot blade assy, 8" (3) / 0010-76174 / Isolation valves (1) / 0010-09056 / SBC Intelligent interface BD 1995 vintage.
AMAT / APPLIED MATERIALS P5000 Mark II is an etch and deposition reactor designed to manufacture integrated circuits. The P5000 is a vertical single-wafer processing chamber, capable of etching and depositing films onto semiconductor wafers. The system contains a process module which holds the deposition source, a transfer arm to move the wafers between the various processing components, and a turbo-pump system which maintains a vacuum in the processing chamber. AMAT P5000 Mark II offers standard wafer sizes between 4 and 12 inches and cruising speeds of up to 33 cm per second when transferring wafers. APPLIED MATERIALS P 5000 MARK II offers programmable process conditions, including temperature, pressure, and power, to custom-tailor the deposition process to the user's desired materials, targets, and device structures. APPLIED MATERIALS P5000 Mark II also provides advanced uniformity control and ECR capabilities, allowing for precise control over the deposited film thickness and uniformity. P 5000 MARK II offers an array of deposition sources and etching processes, including chemical vapor deposition (CVD), physical vapor deposition (PVD), and etching. The CVD process can deposit films of silicon, silicon oxynitride, nitride, and other materials. The PVD process can deposit metal films, including copper, aluminum, and titanium. The etching process can be used for deep etching or for etching shallow trenches with very sharp corners, allowing for improved device performance. AMAT P 5000 MARK II contains advanced cooling features, including a cooling plate that helps maintain temperatures within the wafer processing chamber. Additionally, AMAT / APPLIED MATERIALS P 5000 MARK II has an improved power detector that enables higher etch rates and finer control of the process. P5000 Mark II provides versatile, accurate, and stable processing, making it an ideal choice for integrated circuit production. With a comprehensive list of features, it is a reliable system for achieving uniform, repeatable results, making it an excellent choice for the production of advanced chips and devices.
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