Used STS / CPX Multiplex #9071736 for sale
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ID: 9071736
Wafer Size: 3"-8"
PECVD System, 6"
Operating system: Window 98
Capable of 3"- 8"
Currently depositing: SiO2, Si3N4
Single chamber loadlock
Substrate size: Pieces up to 8"
AE Low RF & high RF generator
SMC Chiller for shower head
Single vane pump for loadlock
Pump / Blower package for chamber
Gas lines:
2%SiH4 in N2
N2O
NH3
N2
Cleaning gases:
O2
CF4
208 VAC, 60 Hz, 3P, 5W
~1997 vintage.
STS / CPX Multiplex is an etcher/asher equipment designed for the high-throughput processing of photomask substrates. It uses multiprobe etching/ashing technology to handle a wide variety of application requirements including High Aspect Ratio (HAR) etching/ashing, side etching/ashing, as well as other advanced process technologies. The system is designed for stability, consistency and high-throughput with the ability to process up to 200 samples in a single run. At the heart of the unit is a high-precision, dual-probe stage which operates within tight process-control parameters to ensure repeatable and reliable etching/ashing results. The dual-probe provides extremely fine accuracy allowing for a wide range of process parameter adjustment. The machine is also equipped with integrated scanning technology that allows users to quickly and accurately generate appropriate etching/ashing masks. This significantly helps improve the accuracy and speed of high-precision processes, reducing cycle times and increasing throughput. The advanced end-point detection capability of the tool ensures that critical process steps are accurately monitored, significantly reducing both over- and under-etching/ashing as well as the risk of contamination. STS Multiplex uses low-abrasion technology to process a wide range of materials, including single- and double-layer photomasks, and provide consistent etching/ashing results over multiple jobs. CPX Multiplex systems have full digital control, allowing precise and uniform etching/ashing on all applicable materials, and reducing operator-error risks. The systems are also equipped with robust end-point detection, allowing accurate product throughput and uniform results. The asset includes a range of optional hardware and software features, including high-resolution real-time temperature monitoring, real-time plotting of etching/ashing curves, and an integrated, user-friendly graphic interface. The model has a wide range of process parameters which can be adjusted for specific applications, and applied simultaneously, providing precise and reliable process control. Multiplex etcher/asher systems are compatible with the latest etching/ashing technologies and materials, and are integrated with the most advanced process control systems. Its robust, full-function design provides high-quality and reliable etching/ashing performance on a variety of materials, and its process stability ensures that critical processes are monitored and executed accurately. The equipment also provides maximum flexibility and versatility, allowing for compatibility with a variety of application requirements and etching/ashing materials. The system provides users with a high-throughput, highly reliable etching/ashing process that meets the needs of the most stringent applications.
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