Used APS NOVASTAR GF 120 #9181967 for sale

Manufacturer
APS NOVASTAR
Model
GF 120
ID: 9181967
HC / HT Reflow oven.
APS NOVASTAR GF 120 is a reflow oven specifically designed to accommodate larger boards, wave soldering and vapor phase processes. It is capable of producing SMT assemblies up to 455 mm (17.9 inch) wide and reaching temperatures up to 260°C (500°F). The oven features a cleverly designed cylindrical shape with 4 fan zones, inducers, and an air-locks equipment that ensures precise temperature control. The full setup of the oven begins with pre-heating, which is done with induction for maximum accuracy and speed. The pre-heater chamber consists of stainless steel panels that are heated by individually controlled inductors, and can provide a peak temperature of up to 225°C (437°F). The induction system helps to accurately heat components without any risk of exposing them to oxidation or shorting. Once the components have reached their optimal temperature, the boards are transferred into the reflow itself. This chamber is gas-fired with unique air locks per chamber that manages the pressure through the process. This air-lock unit is important in ensuring consistent results as it keeps external air from entering the chamber and interfering with the heating pattern inside. The maximum temperature of the chamber can be set up to 260°C (500°F). The chamber is divided into four zones containing fans ducted in the main top and bottom bodies. The fans are individually adjustable and they ensure that the heat is evenly distributed over the entire board. The oven is also fitted with an ionizer that minimizes the static electricity that can build up during the process. The ideal process for soldering components with a NOVASTAR GF 120 involves passing through each of the zones with the board, for the reflow to take place. The speed of the movement and the temperature profiles can be adjusted as per need, depending on the number and type of the components in the board, and the solder paste. The whole process is monitored and documented with a powerful RIP software that ensures maximum traceability of the assembly process. The software can also be interfaced with external modules to help create unique profiles, back up production data, and find the exact location of each product in the plant. Finally, the boards are cooled in the cooling chamber which uses convection cooling to ensure a gentle and gradual decline in temperature to make sure that the soldered components are kept intact. After the board comes out of the oven, it is ready for assembly. APS NOVASTAR GF 120 is a powerful reflow oven that offers superior performance and accuracy. With its robust design and efficient air-lock machine, this oven is capable of providing consistent results on a range of soldering surfaces, accommodating larger boards with ease.
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