Used ACCRETECH / TSK AWD-200T #9146470 for sale

ACCRETECH / TSK AWD-200T is a scribing/dicing system used for creating patterns in glass substrates, semiconductor wafers, silicon wafers, and other materials. It is suitable for precision applications such as precision cutting of mask patterns, electrical circuits, as well as shape conversion of formed substrates. TSK AWD 200 T is equipped with a temperature-controlled vacuum chuck that enables the system to secure materials such as glass substrates with high precision and stability. The variable temperature range of the chuck enables users to set the desired temperature for the process. It also features a 4-axis motor that provides high precision movement which is essential for creating intricate patterns. ACCRETECH A-WD-200T is also equipped with a CCD camera that supports dynamic active alignment. This allows the system to accurately align the pattern with the substrate surface. The camera is also capable of overshoot detection which allows it to control the scribing/dicing process with precision. A-WD-200T supports several different scribing/dicing methods, including laser dicing, mechanical scribing, laser ablation, and grinding. With the proper settings, the user can set specific parameters such as the speed of the pattern movement, the acceleration profile of the pattern movement, the number of passes, the resolution of the pattern, and the cutting depth. ACCRETECH AWD 200 T also incorporates a time-optimized function which allows the user to configure the best settings to save time in the scribing/dicing process. This function automatically optimizes the speed and acceleration of the pattern movement for the best throughput. AWD 200 T is a versatile tool that can be used to produce precise patterns on various materials. It's well-suited for use in a variety of precision applications that require precise patterns on substrates. With the active alignment and time-optimized features, it offers a powerful platform for creating high-quality patterns with optimal throughput.