Used ACCRETECH / TSK AWD-5000A #9164222 for sale

ACCRETECH / TSK AWD-5000A is a scribing and dicing equipment specifically designed for use with semiconductor substrates. It is capable of producing ultra-fine, precise cut lines and features with major advances in precision, accuracy, throughput and user convenience. TSK AWD 5000A is designed for the splitting, thinning, and sample preparation of wafers and chips. ACCRETECH A-WD-5000A offers a variety of cutting options, including scribing and dicing. Scribing is the process of creating a straight line of cuts in the substrate's surface. This system utilizes precision stage units; optical guides; laser processing; two or four axis drive systems and algorithms optimized for different types of scribes. It also features a specialised view camera unit used for test and observation of the substrate's surface. The machine's output is generated by an auto-focusing, low power CO2 laser, making it especially useful for processing areas too small for conventional mechanical processing. Its output is also accurate and repeatable, and is associated with minimal heat generation. Dicing is the process of dividing a substrate into pieces of a specific and desired size. A WD 5000 A combines precision mechanical positioning and high-speed laser cutting to produce dices as small as 350μm. This is accomplished by the tool's high speed micro-stepper motor and scan mirrors, which move the laser beam to precisely locate the area to be dicing. Its automatic measurement and adjustment asset also increases output accuracy. ACCRETECH / TSK A WD 5000 A is equipped with 1D, 2D and 3D scan overview, auto centering and beam size calibration. This minimizes troubleshooting and enhances product repeatability, while its auto-calibrating pattern and program setting increases productivity. ACCRETECH / TSK A-WD-5000A also offers a variety of additional advantages, including a user-friendly interface, simplified maintenance, and the ability to process multiple substrates at once. It is designed to reduce process time and minimize operator fatigue, allowing users to work faster and more efficiently. The model is useful for both functional and non-functional testing of semiconductor parts. Overall, ACCRETECH A WD 5000 A's scribing and dicing capabilities make it an ideal equipment for cutting wafers and chips to extremely precise standards. Its ability to process multiple substrates at once increases productivity, and its user-friendly interface, minimized maintenance and automated features make it a powerful and reliable system for users.