Used ACCRETECH / TSK AD 3000T #9162326 for sale

ID: 9162326
Dicing saw.
ACCRETECH / TSK AD 3000T is a scribing and dicing equipment designed for in-line dicing of semiconductor wafers. The system consists of an XYZ robot with a scribing head and a dicing head, an automatic loading unit, and an optical microscopy machine. The XYZ robot is capable of holding wafers up to 300 mm in size and is equipped with a motion control tool for high precision motion control. The scribing head is designed for efficient laser scribing, allowing for high-precision scribing with minimum debris and movement. The dicing head is designed for efficient, high-precision cutting and dicing of wafers. The automatic loading asset can load up to twelve wafers into the robot, allowing for faster processing, and the optical microscopy model can be used to verify the quality of the dicing process. TSK AD3000T equipment is capable of performing precision scribing and dicing even if the material of the wafer is hard or brittle. The speed, accuracy, precision, and accuracy of the system allows for fast and efficient processing of wafers. The unit is also highly capable of making extensive shape and size adjustments with little risk of cracking the material during the operations. This results in better yields compared to manual slicing and dicing. ACCRETECH AD-3000T is designed with safety in mind and includes safety features such as interlock sensors to reduce the risk of injury to the operator and a dust collection machine to ensure a dust-free atmosphere. The tool also has a comprehensive user interface to allow easy monitoring and maintenance of the asset. Overall, TSK AD 3000T scribing and dicing model is a powerful, highly precise equipment that provides fast, accurate, and repeatable results. It is designed to be a reliable and efficient system for in-line dicing of semiconductor wafers, offering superior yields compared to manual slicing and dicing and a safe environment for the operator.
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