Used ACCRETECH / TSK AD-WD-5000-A #9142368 for sale

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ACCRETECH / TSK AD-WD-5000-A
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ID: 9142368
Vintage: 1997
Wafer saws 1997 vintage.
ACCRETECH / TSK AD-WD-5000-A is a highly accelerated scribing / dicing equipment that is extremely well suited to high performance wafer processing applications. The scribing/dicing system can operate at speeds up to 4-5X faster than conventional systems, and is capable of slicing up to 150 wafers per hour (when scribing multiple wafers). The unit features an advanced array of sensors and precision motion control systems that enable positioning accuracy of ±1 μm and repeatability of 0.7 μm. This high degree of accuracy and repeatability allows for a consistent and reliable cut, ensuring high yields in the dicing process. In addition, the machine offers "smart" controls, which allows for custom settings and automatic calibration. In addition, the machine features a high-resolution video camera that can be used to both monitor and adjust the scribing / dicing process. This allows for better control over the cutting process, helping to reduce the complexity of the setup and troubleshooting steps. TSK AD-WD-5000-A is powered by a high-performance linear servo motor, which enables fast head accelerations of up to 3gs and peak cutting speeds of 50m/s. This acceleration rate is significantly faster than conventional systems. The tool also features an advanced cooling asset, which helps to keep the model cool during operation while providing precise thermal uniformity across the wafer. Finally, the scribing/dicing equipment offers an integrated safety system which includes both a contact sensor and a thermal overload protection unit. This ensures a high level of safety for workers in the vicinity of the machine, as well as providing additional protection against damage to the cutting tool or the wafer. In conclusion, ACCRETECH AD-WD-5000-A is an advanced and highly reliable scribing/dicing machine that is perfect for high-volume wafer processing applications. The tool provides a high degree of accuracy and repeatability, as well as an integrated array of safety features. These features, combined with the high speed of the asset, make this an extremely efficient and cost-effective option for wafer processing applications.
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