Used ACCRETECH / TSK AWD-300T #9169174 for sale

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ACCRETECH / TSK AWD-300T
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ID: 9169174
Wafer Size: 12"
Vintage: 2004
Dicing saw, 12" 2004 vintage.
ACCRETECH / TSK AWD-300T is a scribing/dicing equipment designed for microelectronics packaging applications. It features a dual-axis scribing stage, which allows it to quickly and precisely scribe (cut) the substrate into a variety of patterns and shapes. TSK AWD 300T also features a high-speed dicing saw, which can quickly and precisely divide the substrate into small pieces for easier handling and assembly. The scribing stage is driven by an AC servo motor with an encoder resolution of 0.2 μm. This results in a scribing accuracy of ± 0.1 mm, ensuring accuracy and repeatability. The system can also handle difficult materials such as ceramic and fiber-filled epoxy coatings. The dicing saw is a high-speed air-cooled spindle that can reach speeds of up to 60,000 rpm. It is capable of producing cuts up to 250 μm in width. The saw is designed for high precision and repeatability, with an accuracy of ± 0.02 mm and a repeatability of ± 0.03 mm. ACCRETECH A-WD 300T also features a high-resolution 3D microscope for microscopic inspection of the scribed and diced surface of the substrate. The microscope can detect defects such as scratching, cracking, and voiding, which can result in inferior packaging. In addition, the unit has a laser engraving/etching machine for direct laser marking on the substrate. This enables the user to quickly and accurately mark various shapes and logos on the substrate for branding purposes. ACCRETECH / TSK AWD 300T is a powerful and versatile scribing/dicing tool for microelectronics packaging applications. It offers high precision and repeatability, a wide range of capabilities, and the ability to handle a variety of materials. With its range of features, ACCRETECH A WD 300 T is an invaluable tool for businesses looking to increase their production speed and efficiency.
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