Used ACCRETECH / TSK UF 200 #9192634 for sale

ACCRETECH / TSK UF 200 is a prober designed for complex IC probing applications. It is designed to provide high accuracy, high resolution, and maximum throughput for wafer probing, bump probing, and high-density pad probing and probing at high pin count. The prober is constructed from stainless steel and alumina. The prober is equipped with an aligned, X, Y and Z directions and a stationary worktable. The worktable is made of a high-rigidity aluminum alloy and is convenient for long-term and multiple job processes. TSK UF 200 has a large 200 mm X 200 mm X. The prober also has a low settling time of just 150 μs to ensure accurate and precise positioning. The prober also features a high throughput of up to 3000 chips/hour and offers easy wafer alignment and pattern recognition. The prober also features two vacuum ports for better sealing. The two vacuum ports support different formats such as vacuum or surface-mount chips. The vacuum ports also support bump or high-density patching and have high repeatability. ACCRETECH UF200 is capable of repositioning accuracy of 1 μm and is environmentally friendly and low vibration. The prober is ideal for unidirectional and bidirectional long-term operations. The prober also has an integrated safety and control circuit and an on-board vision system. A large-diameter camera with high-resolution and a large lighting capacity is included as well. ACCRETECH UF 200 is an easy to use and reliable prober that can be used in several different applications. The prober is designed to meet the highest standards in accuracy, stability, and throughput, and is suited for laboratories, universities, and research and development centers.