Used AMAT / APPLIED MATERIALS Mirra 3400 Titan 1 #9114847 for sale

AMAT / APPLIED MATERIALS Mirra 3400 Titan 1 wafer grinding, lapping, and polishing equipment provides precision control of wafer surface geometric parameters in order to facilitate advanced semiconductor research and test/production applications. The system boasts a full range of motorized motion along multiple axes and is capable of producing finalized planarized wafers in sizes ranging up to 8-in. AMAT Mirra 3400 Titan 1 comes with an integrated wafer belt unit and is engineered with a high-precision vibration-free optical table. It is designed to facilitate precise motion while compensating disturbances introduced by the mechanical components of the machine. APPLIED MATERIALS Mirra 3400 Titan 1 is capable of high-precision precision lapping and polishing processes including polishing to meet ultra-smooth surface topography standards. It is equipped with brushless servomotors for high speed and precise motion, dynamic force control and superior profile controllability. The embedded machine vision camera automatically detects wafer edge for for precise wafer-to-wafer processing. The embedded machine vision functions also include performance of automatic wafer orientation, identification of center and outliers wafers for matching the production program. The tool consists of a rigid cast aluminum alloy base that is temperature-compensated to ensure thermal stability of the asset. This feature also facilitates targeted thermal conductivity and improved sound attenuation. Mirra 3400 Titan 1 is furnished with an advanced touchscreen control model that monitors process parameters and allows for precise control of lapping/polishing speed, direction as well as results. The equipment is also designed to minimize cleaning requirements and downtime. It utilizes a hydraulic polishing head for efficient wafer transport, manipulation and handling. The system is equipped with a temperature exhaust hood that disperses heat from the unit and reduces airborne contamination. Additionally, the enclosed work chamber is filtered and pressurized, preventing the escape of airborne contaminants. The advanced design of AMAT / APPLIED MATERIALS Mirra 3400 Titan 1 wafer grinding, lapping, and polishing unit provides sophisticated and efficient wafer surface processing in research and production applications. It is an ideal solution for advanced semiconductor processing, allowing for precise lapping and polishing of wafers without introducing much noise or contamination.