Used ANATECH / TECHNICS HUMMER 8.1 #9055839 for sale

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ANATECH / TECHNICS HUMMER 8.1
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ID: 9055839
Metal deposition system Gun: 4" Chiller Planar magnetron sputter source: 4" diameter Power supply: 1000W.
ANATECH Hummer 8.1 is a one of a kind sputtering equipment designed to deposit thin films of materials onto substrates. Its two-stage design and array of features allows for precise film deposition and a high degree of process control. TECHNICS Hummer 8.1 features a first-stage sputtering chamber, a high-vacuum process chamber, and two low-vacuum systems. The first-stage chamber contains a W-type SHS source for sputter coating. This chamber is equipped with a target movement system for in-situ target exchange and a variety of sputtering control options. The high-vacuum process chamber contains a turbo-molecular pump for pressure stability as well as a cryo ion etching unit and turbo-molecular-pumped quad-plasma machine. Both the high-vacuum chamber and the first-stage sputtering chamber are capable of operating under a variety of power settings. ANATECH / TECHNICS Hummer 8.1 offers users the ability to perform a variety of sputtering processes. The unit is capable of different sputtering techniques, such as RF, DC, and pulse sputtering. As well, the tool also features a range of etching processes, such as Arches, magnetron, and PVD. The asset also allows users to configure their sputtering process settings to their exact requirements. In addition, ANATECH Hummer 8.1 features a wide range of in-situ diagnostics and process monitoring. The diagnostics model includes a variety of sensors and controllers that allow users to monitor and control their process parameters in real time. The Hummer 8.1 also provides users with a range of software monitoring and control systems as well. The software allows users to monitor the current status of the process, investigate previous process results, and create patterns and programs for their sputtering processes. Overall, TECHNICS Hummer 8.1 is an ideal sputtering equipment and offers users the ability to precisely deposit thin films of materials onto substrates. Its range of features and precision control allow for a high degree of process control. This system is capable of performing a variety of sputtering techniques as well as a range of in-situ diagnostics and process monitoring, making it one of the most advanced sputtering systems available.
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