Used VARIAN 3290 #9174775 for sale

VARIAN 3290 sputtering equipment is uniquely designed to provide robust, high performance, and advanced sputtering and evaporation capabilities for a wide range of materials and applications. This high level of performance is achieved through its carefully designed, at-grade components, which include a precision-controlled DC high-frequency power supply, a choice of three Turbo-Pumped and turbomolecular-pumped ultra-high vacuum levels (UHV), one-touch control over sputtering chambers and vacuum levels, and a variety of advanced features. The high performance of 3290 is enabled by its advanced design and engineering elements, including its completely hermetically sealed release valves, which feature non-flammable and non-toxic pneumatic and electrical catalysts, and its high-vacuum chamber, which includes a combination of an evacuated argon environment and a unique heating system. In addition, the power supply is highly efficient and precisely controlled, while the sputtering chambers offer precise, reliable substrate control. VARIAN 3290 also offers a wide range of applications, including thin film deposition, sputtering of metals and oxides, evaporation, and etching. The unit is capable of providing precise and uniform deposition of polycrystalline and monocrystalline targets, and can also be used for thin film deposition on both rigid and flexible substrates. The temperature-controlled substrate chuck makes it ideal for high-temperature processes, and its easy-to-use features enable fast setup and operation processes. 3290 also features dual source operation, which enables two different substrates to be sputtered at the same time. This ensures that the maximum process speed is achieved with minimal downtime and gives the user greater control over the deposition parameters. Additionally, the machine offers precise feedback on pressure and vacuum levels, allowing for precise and reliable process control. Overall, VARIAN 3290 is a highly reliable, advanced sputtering tool that offers a range of highly versatile and efficient deposition capabilities. Its robust design, precise control, and easy-to-use features make it well-suited for a wide variety of thin film deposition, sputtering, and evaporation applications.