Used ABA FFU 1000 / 60 #9066951 for sale

ABA FFU 1000 / 60
ID: 9066951
Surface grinding machine 1993-2007 vintage.
ABA FFU 1000 / 60 is a high-precision wafer grinding, lapping and polishing machine for the production of semiconductor devices. This advanced equipment includes a series of modules designed to provide superior results in grind and polishing operations on semiconductor materials. The system consists of a high-precision grinding and lapping head, a lapmaster polishing unit, a chip detector, and a multiple-axis motion control machine. The grinding and lapping head of FFU 1000 / 60 is designed to provide superior results during the grind and lapping operations of semiconductor materials. Its advanced design allows for both large, uniform surface cuts as well as fine, precise surface finishing. The rotating head, which is driven by a high-precision motor, utilizes abrasive wet grinding to reduce material layers, and is capable of providing precise cuts in material thicknesses as low as 0.1 microns. The lapmaster module is designed to provide precise lapping and polishing of the semiconductor materials. Its advanced motion control tool is able to move the lapping plate parallel and axially in order to provide uniform polishing results. Its oscillatory motion is also designed to precisely control the lap rate and acceleration. ABA FFU 1000 / 60 chip detector uses optical detection technology to detect and measure the size of any incoming wafers. This allows for an extremely accurate polishing rate to ensure that all wafers are equally polished. This asset is also capable of identifying defective wafers and determining their fault. The motion control model of FFU 1000 / 60 is designed to precisely control all axes of the equipment. This advanced system uses high-precision servomotors and an open-loop control unit to control the grinding, lapping, and polishing operations of the wafers. The machine is designed to reduce or eliminate wafer warping and vibration. ABA FFU 1000 / 60 is the perfect all-in-one solution for the production of high-quality wafers. Its advanced design ensures superior surface finishes, accuracy, and performance. Its precise chip detection tool and high-precision motion control asset ensure that all operations are accurately performed at the highest level of quality.
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