Used ACCRETECH / TSK W-GM-3000 #9185888 for sale

ACCRETECH / TSK W-GM-3000 is a high-precision wafer grinding, lapping and polishing equipment. This fully automated machine processes single or double-side polished wafers in a single operation. The system employs the latest grinding and polishing technologies to ensure the highest levels of accuracy and precision. TSK W-GM-3000 utilizes a high-speed, computer-controlled polishing head for processing wafers. The head houses up to three grinding stones that can independently be raised and lowered as necessary for optimal process control. The unique use of high-precision and high-speed grinding stones enables the unit to polish the surfaces to a specular finish - perfect for a wide range of wafer processing applications. ACCRETECH W-GM 3000 also incorporates an advanced optical metrology machine. This tool uses a combination of two interferometers, an advanced MBSI polarizer, and a photodiode array to measure the thickness and surface flatness of the wafer. This provides an unparalleled level of control as well as excellent feedback on the entire process. The asset also incorporates an automated CAE platform for loading and unloading wafers, as well as a separate grinding and polishing chamber for processing different sizes and types of wafers. ACCRETECH W-GM-3000 is an excellent choice for manufacturers who needhigh-precision grinding, lapping and polishing of wafers. Its advanced process control and high-precision optical metrology model provide a superior wafer surface finish and an unbeatable level of quality control. The equipment's fully automated operation and wide range of size and type processing capabilities make it an excellent choice for a variety of wafer processing applications.