Used ACCRETECH / TSK PG 200 RM #9173535 for sale

ACCRETECH / TSK PG 200 RM Wafer Grinding, Lapping & Polishing Equipment is an all-in-one system designed for precise and efficient surface processing of large semiconductor wafers up to a diameter of 200mm. It is a multi-purpose unit, capable of grinding, lapping and polishing the outer surface of the wafer, ensuring that there are no surface defects. The machine is comprised of one main console unit, which houses the electric motor and controls, and up to four separate SPM modules. Each SPM module houses its own Max-Cell tool (which changes the position of the wafer) and Max-Ring grinding/lapping/polishing tool head. The Max-Ring head has three cutters for grinding, two lapping and one final polishing process. The Max-Cell tool has a built-in anti-collision tool, which prevents any damage to the wafer surface, as well as preventing the tool from moving too quickly or too slowly. TSK PG-200RM is controlled by intuitive software that allows users to pre-program and sequence processes on the tool. High precision is ensured by the software's ability to make fine adjustments to the wafer position and cutter speed. Additionally, the asset features rotary and/or reciprocating motions, as well as up and down movements, allowing for optimized grinding, lapping, and polishing processes. The model is designed to be exceptionally user friendly. Features such as multi-chamber cassette, ID-Chip reader, easy maintenance and a wide range of input options make it an ideal choice for wafer processing. The equipment also offers superior safety features, such as emergency shutdown and safety interlocks. In conclusion, ACCRETECH PG 200RM Wafer Grinding, Lapping & Polishing System is a comprehensive surface processing unit, optimized for maximum efficiency and precision. It offers a wide range of options and features, suitable for a range of wafer processing applications, making it an ideal choice for semiconductor industries.