Used ACCRETECH / TSK PG 200 RM #9188245 for sale

ACCRETECH / TSK PG 200 RM is a wafer grinding, lapping, and polishing equipment designed to grind, lap, and polish a variety of small wafers from 0.1mm to 2.5mm. It utilizes a unique grinding/polishing wheel to provide perfect throughput and flatness while eliminating the need to manually adjust the machine parameters. The system is designed to achieve consistent, repeatable, and precise results even when processing multiple wafers at different stages of the process. TSK PG-200RM is controlled by a touchscreen operation unit, which allows the user to program and adjust the process parameters for each wafer. The parameters are adjusted based on the material type, wafer size, wheel diameter, and wheel type. These parameters control the rotational speed and torque of the grinding or polishing heads, as well as the amount of pressure which is applied to the wafer surface. The unit also features a number of safety features and can be operated in manual or automatic mode. The grinding, lapping, and polishing heads contain diamond abrasives that can produce a variety of textures on the wafer surface. The grinding head is adjustable to an accuracy of one micrometer for precise grinding results. The lapping head is adjustable and is designed to evenly lap wafers with different thicknesses. The polishing head uses diamond paste, enabling the wafer surface to become smooth and flat after processing. The machine has a high-resolution microscope ensuring accurate process control. The microscope is optically aligned and assists in verifying that the process parameters are correct and that the grind, lap, and polish operations are producing the required results. ACCRETECH PG 200RM comes with a variety of accessories such as special wafer holders, cleaning brushes, and a vacuum feeder. It also features a dust removal tool which keeps the process chamber clean and dust free during operation and prevents contamination of the wafers. PG 200RM is ideal for performing grinding, lapping, and polishing operations on wafers for thin film electrical applications such as the manufacture of photovoltaic cells, flat panel displays, and optical device components. In addition, the asset is flexible and user-friendly, allowing users to quickly adjust the process parameters in order to adapt to different wafer sizes, material types, and process goals.