Used ACCRETECH / TSK PG 200 #9155106 for sale

ACCRETECH / TSK PG 200 wafer grinding, lapping & polishing equipment is a powerful, versatile and easy-to-use machine. It is designed to efficiently and accurately finish hard and brittle materials, such as semiconductors, quartz, glass, and ceramics in the production of semiconductor and other components. The machine is equipped with an intuitive touchscreen interface for easy operation and a user-friendly software package which makes setting up and controlling operations a breeze. This system offers high accuracy and precision for all projects, along with a low-cost per part. It also includes a vision unit that allows the operator to observe the processing status in real-time. TSK PG 200 utilizes a three-stage process including grinding, lapping and polishing. During the grinding process, abrasive materials are used to grind away any remaining surface contaminants, such as particles or residual organic materials on the wafer surface. The lapping stage then uses a combination of two diamond-like abrasives to remove any surface bulges or irregularities that occur during the grinding process. Finally, in the polishing stage, the wafer surface is polished using an appropriate polishing agent to achieve the required surface finish. ACCRETECH PG200 has a wide range of features that make it ideal for many different types of jobs. One unique feature is its wide operating range, which enables it to work with large and small wafers. It also has a pressure control function, which allows operators to control the pressure on the wafer to prevent abrasion damage. Its flexible parameters further enhance its performance, as it is able to work with many different types of grinding, lapping and polishing media. In addition, the machine is designed to be safe and easily maintained, ensuring smooth operations over a long period of time. It has an intelligent safety tool, which automatically stops the machine in case of any unexpected event, and a built-in air purification asset, which filters out any particles generated during the process. As a result, PG200 produces wafers with extremely high-precision surfaces while also protecting the operator from potential dust and debris. Overall, ACCRETECH PG 200 wafer grinding, lapping & polishing model is an advanced, reliable and easy-to-use machine with a perfect blend of performance, safety and efficiency. Its wide range of features ensures that it can be used for a variety of tasks and projects with the highest precision, making it an invaluable asset to any facility.