Used ACCRETECH / TSK PG 300 RM #9186014 for sale

ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping, and polishing equipment designed for the industrial production environment. This high-quality, reliable system offers superior performance and precision for a wide range of wafer grinding, lapping, and polishing needs. The unit has a mechanical design that ensures robust reliability and precision. The grinding, lapping and polishing stages are done using high-quality components, providing a smooth, efficient and accurate processing of wafers. TSK PG300RM has a 4.5-inch platen that allows for easy mounting of wafers on platen. It uses a cooling machine to ensure the optimal grinding speed and surface finish. The grinding process utilizes ACCRETECH PG 300RM's efficient diamond grinding wheel, capable of rough or finish grinding materials down to a uniform thickness range of 50-300 microns. The grit size of the diamond grinding wheel can be adjusted according to the wafer requirements. Other grinding media such as BN (bonded alumina si3n4) and CMP (chemical mechanical planarization) can also be used. For lapping, ACCRETECH / TSK PG300RM utilizes its lapping equipment which provides superior lapping accuracy and eliminates surface defects. It uses a specially designed diamond filled lapping film and water, with adjustable lapping speeds. This enables the thickness range to be set between 5-250 microns. The polishing process of TSK PG 300 RM utilizes its high-precision, CMP or RTCMP (room-temperature compatible CMP) wet polishing tool. It utilizes a high-precision polishing pad that is adjustable for planarization and eliminating defects, up to 40 µm. An optional high pressure, low flow asset can be used to precisely control the pressure applied for planarization. The model is designed to be user-friendly with an intuitive software interface that is easy to operate. All operations can be monitored and controlled from the easy to use, user-friendly touch screen. TSK PG 300RM is highly reliable and offers superior performance accuracy. It also provides a wide range of features for customizing the equipment to the end user's specific needs. With its competitively priced, high quality design, this system is an excellent choice for manufacturers and institutions requiring a wafer grinding, lapping and polishing unit.