Used ACCRETECH / TSK PG 300 RM #9188246 for sale

ACCRETECH / TSK PG 300 RM is a fully automated equipment, designed for grinding, lapping, and polishing of integrated circuit (IC) wafers of various sizes and shapes. The system is capable of processing wafers up to 300mm in diameter and can process up to 100 wafers per hour. TSK PG300RM is equipped with two independent spindles, each capable of supporting two grinding or lapping plates. This allows for the simultaneous grinding and lapping of both sides of the wafer at the same time. A Digital Signal Processor (DSP) controls the motors and polishing systems in order to accurately and precisely control the speed and pressure of grinding or lapping. The DSP is capable of easily switching between different grinding and lapping approaches, allowing for quick and easy adaptation to new or different wafer sizes and shapes. ACCRETECH PG 300RM is also equipped with an advanced water-resistant cavity dampening unit, making it suitable for the processing of highly sensitive and delicate IC wafers. This machine uses ultrasonic vibration and recirculating liquid to evenly distribute pressure and friction on the wafer throughout the entire process. The design ensures uniform grinding and lapping of the wafer's surface, resulting in a high-quality finish on both sides. TSK PG 300 RM is equipped with a tactile main unit, making it easy to operate without the use of a computer. This main unit includes control panels, switches, and displays for proper adjustment of speed, pressure and removals rates, as well as monitoring of process parameters and display of the grinding/lapping results. The tool has a wide range of safety features designed to ensure the safety of the operator and the asset itself. This includes an emergency stop button, over-temperature protection, and safety ring, as well as a variety of sensors to detect abnormal environmental conditions. A built-in self-test mode helps to ensure that the model is always running correctly. All in all, PG300RM is an innovative wafer grinding, lapping and polishing equipment, capable of producing high-quality results with minimal operator intervention. With its automated and user friendly controls, PG 300RM is suitable for both large and small scale production.