Used ACCRETECH / TSK PG 300 RM #9165695 for sale
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ID: 9165695
Wafer Size: 12"
Vintage: 2006
Wafer backside grinder, 12"
(4) Chucks mounted to an indexing table system
Auto cleaning unit
Windows NT based operating system
Rough grind station with thickness monitor
Fine grind station with thickness monitor
Integrated polish station with conditioning unit
Graphical user interface (GUI)
LCD Touch panel
Frame laminating system
Alignment system
Front-side wafer de-taping system
Backside OCR
SEMI S2-93 Certified
Options:
By passable door interlock for PG, RM and slurry supply unit
Pad thickness parameter: Allow up to 6 mm pad
2 Channel temperature control unit for cooling spindle
Heating polish head
In-line UV system
Post process thickness measurement gauge
DAF Tape laminator for Pre-cut tape (DAF / Dicing tape)
(1) US Standard facility adapter kit
OCR / BCR (RM unit)
(3) BCR for Input carriers
Interface: SECS / GEM
8" Notched wafer kit for PG300
8" Notched wafer kit for RM300
(2) 8" Wafer cassette / Frame adaptors
Bar-code printer unit
(9) Slot cassette capability
Auto lot split capability
Gas (With (2) cameras for street alignment)
RFID For spinner chuck
Missing parts:
(1) Load port A
(1) 12" H1 Arm
(1) 12" H2 Pad
(1) 12" Spinner table
(1) 12" H4 Pad
(1) 12" Mounting table
(1) 12" Outer ring frame table
(1) 12" Peeling table
(2) Load Port bar code readers
(2) PG Touch screen panels
(1) CCD Camera and controller
(1) Spinner LED
(2) RM Pro-face monitors
2006 vintage.
ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping, and polishing equipment designed to be used in the semiconductor industry. It is a comprehensive solution for producing thin wafers with both high planarity and high micro-roughness quality. This system can precisely control the grinding, lapping, and polishing processes to achieve the desired planarity and surface roughness. It has a specially designed grinding wheel, lapping plate, and diamond pad to ensure that all process parameters are kept within the required level. TSK PG300RM is a fully automatic unit that is controlled by a PLC with an equipment control panel for easier operation. The machine consists of a C-frame and grinding-lapping table, driven by servomotors, and a cross beam for holding the grinding wheel, lapping plate, and diamond pad. The C-frame and table are designed to provide good stability and vibration damping properties. It also has a built-in cleaning tool to ensure that the grinding-lapping table is kept free of debris. The grinding wheel and lapping plate are mounted on the cross beam and are accurately controlled by the PLC. The grinding wheel is used for rough grinding and thinning of the wafers while the lapping plate is used for fine grinding and dust removal. The diamond pad is used for polishing the wafer to a smooth finish. ACCRETECH PG 300RM is also equipped with a CCD camera, which can monitor the process in real time. The asset is capable of polishing wafers from dicing up to 300 mm in diameter. It is also able to accommodate various materials, such as fused silica, quartz, and sapphire. ACCRETECH PG 300 RM is ideal for producing high-quality wafers with excellent planarity and surface roughness. It is a comprehensive model for grinding, lapping, and polishing wafers, providing an efficient and cost-effective solution for semiconductor manufacturers.
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