Used ACCRETECH / TSK PG 300 RM #9192084 for sale

ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping and polishing equipment primarily designed for accurate planarization of semiconductor wafers. With its fully automated technology, the system provides high precision polishing results. It is capable of producing sub-micron flat surfaces on SOI and ultra-thin wafers down to 75μm in thickness. The unit consists of a main body containing a polisher and the grinding and lapping modules, as well as a wafer shipping unit and the grinding, lapping and polishing tool exchange and cleaning unit. The wafer loading and transportation unit can transport multiple substrates up to 8", and the polishing module contains a 800mm diameter polishing head that is able to rotate in both clockwise and counter-clockwise directions. The generous 8.5cm lap height ensures improved results in the shortest of time. The machine also incorporates a touch-screen operator interface that allows for recipe-based control, as well as a variety of process parameters such as speed, pressure, and lubrication. The time-saving CCD (charge-coupled device) monitoring tool checks the status of wafers during the grinding, lapping and polishing process. This helps to ensure consistent product quality and repeatability. The asset offers process technologies such as single-step and two-step grinding-lapping technology, dual-step polishing technology, hot-process polishing technology and dedicated wet-process polishing technology. Additionally, the model can accommodate a variety of slurries chemical components to provide excellent results for various wafer types. Due to its convenience, TSK PG300RM is an excellent choice for the manufacture of semiconductor wafers. It is highly precise and provides excellent uniformity and repeatability. Furthermore, it is easy to use and is capable of handling most wafer sizes and materials with relative ease.