Used AMAT / APPLIED MATERIALS Mirra 3400 #9181312 for sale

AMAT/AMAT / APPLIED MATERIALS Mirra 3400 Equipment is an innovative wafer grinding, lapping, and polishing system designed to produce highly precise and accurate results in the processing of semiconductor wafers. The unit works by allowing users to customize the process parameters to meet their exacting requirements. The flexibility of the machine is designed to enable the optimal results for a variety of process technologies. The tool features a cleanroom compatible environment and a compact footprint that can fit in small, tight areas. The asset is fully configurable to various process setups, including the number and type of equipment and electrodes. An automated wafer library model is included, allowing users to store valuable wafers and process them quickly and efficiently. A 3D surface mapping capability and up to four grinding heads are available. AMAT Mirra 3400 also includes a non-standardized digital-signal-control interface that allows the user to control the entire grinding and polishing process directly from the operator's panel. This interface also allows real-time monitoring and control of process parameters, providing the user with the ability to analyze results and make improvements and corrections to the process setup. The robust equipment features a dual-axis motorized spindle and an advanced servo-driven grinding head and control system that allows for precise positioning of the wafers and electroplated abrasive materials on the grinding surface. The grinding head is designed to address a wide range of substrates, from metals to semiconductor-grade substrates. Additionally, the unit comes with a range of accessories, such as grinding stones, lapping pads, and polishing pads. APPLIED MATERIALS Mirra 3400 is designed to reduce labor and downtime by streamlining the semiconductor wafer production process, and it can be used to process wafers with an overall diameter up to six inches. The robust and reliable machine is one of the most advanced grinding, lapping, and polishing systems on the market, providing users with an efficient and cost-effective way to produce high-quality semiconductor devices.