Used AMAT / APPLIED MATERIALS Mirra Ontrak #9181837 for sale

AMAT / APPLIED MATERIALS Mirra Ontrak is a wafer grinding, lapping, and polishing equipment designed for use on a variety of wafers. The system consists of a high-precision diamond grinding head, a precision lapping head, and a polishing head. Each head is mounted on a precision motorized spindle that is controlled by a PC. The grinding head is programmed to grind materials such as silicon, germanium, quartz and other typical materials used in semiconductor process. The lapping head is used to produce very smooth surfaces on the wafer material. The polishing head is used to produce polished surfaces on the wafer material. AMAT Mirra Ontrak unit is designed to perform a complete range of wafer grinding operations on any semiconductor material. It is equipped with an advanced wafer chuck for controlling the wafer's edge position, a mechanical table for positioning the chuck head, and a spindle for controlling the tool's spinning speed. The machine is designed to process both single and multiple wafers formats. The tool is also designed to accurately measure surface topography, allowing for precise control of the grinding process. The grinding head is designed to produce high-precision grinded surfaces that are highly accurate. It is equipped with a high precision diamond wheel that can be used for various grinding operations. It also has a dust shroud that prevents dust and other particles from being blown onto the wafer. It is equipped with a vacuum asset that is used to collect dust and particles created by the grinding process. The lapping head is designed to produce highly precise flat surfaces on the wafer material. It is equipped with two lapping plates that are mounted on a high-precision motorized spindle. It is also equipped with a pressure regulator that can be used to adjust the pressure between the two lapping plates. The pressure can be adjusted to ensure highly precise and even distribution of abrasive particles over the entire surface of the wafer. The polishing head is designed to produce highly polished surfaces on the wafer material. It uses a high-precision polishing wheel to produce highly polished surfaces. The wheel is driven by a motorized spindle that is controlled by a PC. It is also equipped with a head pressure regulator to help achieve precise pressure between the wheel and the wafer. The model is designed for easy and precise material handling. It is equipped with a wafer loading equipment that can be used to lift and place the wafer material onto the chuck head. The system also has a cooling and cleaning feature that is used to cool and clean the wafer while it is being processed. The unit can process both single and multiple wafer formats. In conclusion, APPLIED MATERIALS Mirra Ontrak is a wafer grinding, lapping, and polishing machine that is capable of producing high precision surfaces on a variety of wafer materials. The tool is equipped with advanced features such as adjustable head pressure regulators and vacuum systems that ensure accurate and efficient grinding, lapping, and polishing processes.