Used AMAT / APPLIED MATERIALS Mirra #9160369 for sale

AMAT / APPLIED MATERIALS Mirra wafer grinding, lapping & polishing equipment is a state-of-the-art automated system designed to provide controlled polishing of wafer surfaces for enhanced quality of semiconductor components and assemblies. This unit utilizes proprietary software to control the process of grinding, lapping, and polishing of ultra-precision photonics components and subassemblies. The machine includes a compact control cabinet to house the entire process, including a base plate, power control unit, motorized spindle base, grinding stage, and polishing head. There is also a dedicated pressure control tool that incorporates closed loop controlled pressure control for precise grinding, lapping and polishing operations, as well as a closed loop feed-back for precise process control. The asset also includes a powerful, programmable digital servo model to precisely control the rotation speed, torque and power to the spindle and grinding stage, as well as performing in-process grinding device monitoring. AMAT Mirra is capable of providing controlled grinding of 200 nanometer, and lapping and polishing of 1.5 nanometer on proximity fields.The equipment is well-suited for production quality measurements, and is able to maintain consistent results for high quality parts. The robotically controlled polishing heads achieve optimal production accuracy and quality for wafer surfaces. The wafers can be loaded and unloaded with minimal operator intervention using automated loaders and software control. The system is user friendly and ergonomic, and is capable of producing repeatable results. The unit is designed to provide excellent performance and low maintenance, with the same short cycle time as traditional manual processing. The machine is also designed to be compliant with OSHA safety standards. APPLIED MATERIALS Mirra has a modular design that allows additional components to be added if needed. The tool can also be connected to other AMAT wafer processing systems, such as APPLIED MATERIALS Mira III for more advanced wafer grinding and polishing. The asset is also compatible with multiple industry-standard lithography systems, and is compatible with multiple mask generating systems. The complete process is highly automated and can be controlled with precision.