Used AMAT / APPLIED MATERIALS Mirra 3400 #9180955 for sale

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ID: 9180955
Wafer Size: 6"
Vintage: 1996
CMP System, 6" Round wafer Silicon oxide Polyimide A-Si Wafer thickness: 380 – 1.200 microns +/- 15 microns Electric data: 208 V, 200 A, 45 kVA, Standby 6.5 kVA 1996 vintage.
AMAT / APPLIED MATERIALS Mirra 3400 is a wafer grinding, lapping and polishing equipment designed to achieve high surface quality and dimensional accuracy on semiconductor manufacturing materials. It is designed to process materials such as silicon, gallium nitride, sapphire, and diamond. The Mirra is capable of handling wafers up to a 200mm in diameter and a thickness range of between 0.5 - 3.5 mm. AMAT Mirra 3400 employs a double-sided grinder preparation technology to generate flat and mirror surfaces on both sides of the wafer and can accommodate up to four abrasive discs. The system is equipped with an advanced robotic arm and a computer-controlled grinding head to ensure precise grind-and-polish repeatability and uniform surface finishes with uniform depth of grind. APPLIED MATERIALS Mirra 3400 also comes with an advanced control unit for automated wafer measurement, process control and operator safety. It features a graphical user interface with real-time processing parameters, such as input, output and current wafer positions, grinding pressure, and safety settings. Mirra 3400 includes an integrated vision machine for process monitoring and quality assurance as well as automated lapping functions that ensure consistent preparation of all sample surfaces. The built-in lapping parameters include lapping depth, lapping speed and lapping tools. The vision tool is integrated with the grinding controller to allow precise measurements of the ground surfaces. AMAT / APPLIED MATERIALS Mirra 3400 offers a wide range of grinding, lapping and polishing functions. Its user-friendly interface and modular setup make it ideal for both industrial and research-based applications. It is capable of precise grinding and polishing of a wide range of materials, such as Silicon and Gallium Nitride, creating uniform surfaces that are better suited for subsequent chip processing. AMAT Mirra 3400 is designed to provide a complete process capability with precise positional control as well as precise uniformity of the surfaces. The lapping capability can ensure precise depth and uniformity of the lapped surface, thus ensuring precise polishing operations with no risk of damaging the wafer. APPLIED MATERIALS Mirra 3400 is a highly precise and robust machine that is built to last and perform precise operations. It is equipped with industrial-grade electric motor and electronics to maximize grinding and lapping performance as well as ensure quality and consistency in the final product.
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