Used DISCO DGP 8761 #9164894 for sale

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ID: 9164894
Wafer Size: 6"
Vintage: 2012
Grinder / Polisher, 6" Equipment details: Fully automatic frame wafer thinning system: 150mm Sapphire Section I: Machine standards (4) Chuck tables configuration (3) Spindles configuration Z3 Spindle configured for dry polishing Height gauge: 2.4 mm Chuck table: 150 mm Cassette to cassette operation Incorporated wash station Includes: Uninterruptible power supply Not includes: Transformer Included options: Auto setup DTU1531 Temperature control unit (4) Wheels Dry polishing pads 3" Wafer capability in conjunction 6" Wafer capability (DP Pad Modification) Currently stored in cleanroom 2012 vintage.
DISCO DGP 8761 is a high-tech, high-precision wafer grinding, lapping and polishing equipment designed to ensure superior performance in the most demanding industrial and research applications. It has been engineered to yield exceptional results in an automated, unattended fashion, ensuring a high level of wafer grinding, lapping and polishing quality. DISCO DGP8761 is comprised of a grinding unit and a lapping unit, both of which boast superior performance. The grinding unit is equipped with a high-precision, high-torque motor that can achieve speeds of up to 36,000 rpm. This unit also features a high accuracy spindle and advanced vibration dampening technology for superior surface finish quality. The lapping unit is equipped with an advanced drive system that enables superior precision during lapping and polishing processes. This unit features two high-quality bearing units and a horizontal motion unit that provide superior control of surface quality and uniformity. To further ensure surface uniformity, the lapping unit is equipped with a high-precision control machine which enables precise adjustment of load and accurately maintains the surface finish specified. Both the grinding and the lapping unit are operated via a highly user-friendly graphical user interface (GUI). This intuitive interface allows operators to quickly and easily setup the tool and monitor its operation. Furthermore, DGP 8761 also comes with a host of diagnostic tools to ensure reliable and accurate operation. In addition to a superior grinding and lapping performance, DGP8761 also offers unmatched convenience and efficiency. It has a small footprint that fits easily into existing production lines, and its modular construction allows users to expand its performance as required. Last but not least, it comes with a host of safety features including an emergency stop button, a vibration monitor, and a 'safe mode' that prevents injury to machine operators. DISCO DGP 8761 truly exemplifies cutting-edge performance and precision in wafer grinding, lapping and polishing. With its intuitive design, superior performance and convenience, DISCO DGP8761 is the perfect choice for every demanding production facility.
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