Used HOFFMAN PR-1 66T #9095930 for sale

HOFFMAN PR-1 66T is a superior wafer grinding, lapping and polishing equipment that provides outstanding results even on challenging substrates or patterns. The system consists of a large CCD vision-based control station, two mechanical grinding stages, two mechanical lapping stages, and two compressed-air-driven polishing stations. The CCD vision station includes an effective Image Recognition unit which automatically controls the machine movements and the pattern determination for each new wafer. The Image Recognition algorithm can detect different patterns and orientations on both front and back sides of the wafer, resulting in precise grinding and polishing along the desired pattern. The two mechanical grinding stages are designed to provide enhanced repeatability and durability and are equipped with diamond grinding wheels for high-precision surface preparation. The pattern recognition machine is integrated into the grinding stages for superior accuracy. The grinder can be set for fast and efficient grinding and is designed for optimized chip removal, and to achieve the desired roughness and surface finish. The grinding stages are capable of processing wafers up to 200mm in diameter. The two mechanical lapping stages of HOFFMAN PR-1-66T are designed to achieve the highest possible surface finish. The lapping is done using a novel process which allows for the rapid removal of surface defects and the precise control of the individual wafer surfaces. The lapping stages can handle wafers up to 200mm in diameter. The two compressed-air-driven polishing stations of PR-1/ 66T are designed for mirror-like finish of the wafer surfaces. The polishing is done using a combination of abrasive slurry and air, and the result is a highly accurate and uniform surface finish. The polishing stations can process wafers up to 200mm in diameter. With its innovative design and advanced technologies, HOFFMAN PR-1/ 66T is an ideal tool for precise, cost-effective grinding, lapping, and polishing of wafers. It is a reliable and robust asset which offers both high precision and high productivity.