Used SILTEC / CYBEC 3800 #9072114 for sale

SILTEC / CYBEC 3800 is an advanced wafer grinding, lapping, and polishing equipment designed for the production of precision semiconductor wafers. The system uses state-of-the-art technology to ensure high surface quality and accuracy with every processed wafer. This versatile unit includes a primary plate grinding unit to achieve a uniform surface finish, a global planarization block, and a precision diamond grinding and lapping block. The primary plate grinding unit allows for rapid removal of material at an adjustable feed rate of up to 8g/s, and utilizes variable pressure adjustment of up to 15N/cm2. This unit also includes a 200mm wafer plate for precise grinding and lapping results with minimal burring. The global planarization block is designed to achieve an even surface finish along the X and Y axes, with uniform thickness. This precision diamond grinding and lapping block uses a diamond pad with a soft diamond to provide a very fine polished finish, as well as precision lap surface effects. CYBEC 3800 includes programmable grinding plates for improved accuracy and speed. In addition, it features a repeatability accuracy of +/- 1um within a 50 cm range. It also has a maximum grinding speed of 30 m/s, a rotation speed of up to 4000 cycles/minute, and a grinding depth of up to 2mm. The machine also includes an intuitive user interface that allows for easy customization of settings and parameters according to the specific requirements of the wafer production process. This also comes with a variety of preset programs for different grinding and polishing operations. SILTEC 3800 is a reliable and efficient tool for precision wafer grinding, lapping, and polishing. It is a versatile asset with precise grinding and lapping capabilities, allowing for high-quality wafer production with maximum productivity.