Used ADE / KLA / TENCOR UltraScan 9600 #9105667 for sale

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ADE / KLA / TENCOR UltraScan 9600
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ID: 9105667
Wafer metrology system E Plus station Hi/Lo Res stations (5) Cassette elevator stations ACS Computer Optional non contact typing.
ADE / KLA / TENCOR UltraScan 9600 is a powerful and versatile closed-loop, non-destructive wafer testing and metrology equipment providing detailed surface analysis of flat panel displays and semiconductor wafers. The system features a high-resolution optical microscope, two laser scatterometers, an edge-lit illuminating unit, a non-contact three-dimensional probe, and advanced data acquisition, analysis, and processing capabilities. ADE UltraScan 9600 uses advanced optics and illumination techniques to provide superior wafer surface imaging, such as edge isolation, feature detection, and detailed surface measurements. The laser scatterometers measure and display both forward and backward scattering information, enabling high-speed, non-destructive measurements and analysis of surface topography, etch depth, and line width. The edge-lit illumination machine, which automatically adjusts focus, provides higher contrast and improved surface identification. The non-contact, three-dimensional probe is used to measure and display wafer thickness and curvature, surface roughness, and other topographical parameters. The probe also collects real-time information to aid in the evaluation of process variability. KLA ULTRA SCAN 9600 is highly automated, providing fast and repeatable wafer testing and metrology with enhanced tool resolution and data acquisition speed. It can store up to 2000 sets of data per wafer, allowing for exhaustive surface analysis and troubleshooting. Additionally, the asset is compatible with a variety of data storage options and can be integrated with other ADE systems for seamless, end-to-end wafer testing and metrology solutions. ADE ULTRA SCAN 9600 is a reliable and efficient wafer testing and metrology model for flat panel displays and semiconductor wafers, enabling detailed surface analysis and rapid process optimization.
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