Used ACCRETECH / TSK RVF600A-X2 #181765 for sale

ACCRETECH / TSK RVF600A-X2 is a comprehensive wafer testing and metrology equipment that is designed to meet the demands of advanced semiconductor production. It facilitates quick, accurate and automated measurements that cover a wide range of wafer features and device parameters. TSK RVF600A-X2 is outfitted with an automated focus adjustment mechanism and a multi-sensor optical system that can detect features as small as 2µm. It features laser microscopy diffraction, microscopic imaging, and a wide field of vision to enable wafer measurements of high level profiles, extractions and reconstructions. Furthermore, the unit is designed with an easy to use graphical user interface and a high-precision manipulator to enable fast and accurate measurement of wafers from any orientation. Moreover, the imaging resolution is adjustable with magnification up to 1,000X, which can enable the measurement of 1µm high profiles. ACCRETECH RVF600A-X2 also provides automated defect review with both 2D and 3D stitch imaging, and contains built-in libraries of defect types with machine-learning algorithms. This helps to reduce false positives and unnecessary manual review of low priority defects. To further enhance the accuracy of the machine, it is equipped with automatic drift correction for fast, accurate and reliable measurements. Additionally, it features an Object Identification & Contouring (OIC) tool, enabling automatic detection and segmentation of objects. This helps faculty surface visual identification of wafer features during production processes. The robust sensing and imaging asset of RVF600A-X2 make it an ideal choice for a wide range of wafer testing and metrology needs. It ensures accurate and repeatable results and is suitable for fast-paced semiconductor production environments. Furthermore the model features a wide range of connectivity and compatibility, making it easy to integrate into existing production lines.