Used ADE / KLA / TENCOR 6033T #9194726 for sale

ADE / KLA / TENCOR 6033T is a comprehensive wafer testing and metrology equipment that enables comprehensive electrical, optical and dimensional measurements on wafers. The system leverages combined technologies of both software and hardware to provide advanced solutions for non-destructive testing of wafers. ADE 6033T unit is built on the basis of a Plasma Bare Wafer Stepper (PBWS) platform, an automated device designed to process wafers. This machine provides various advanced capabilities such as wafer mapping, electrical defect analysis, optical defect inspection, and dimensional metrology capabilities. It can detect and measure tiny features down to the nanometer scale. KLA 6033T is equipped with multiple segments including a stepper scanner/handler for wafer placement, a load port tool, and automated wafer identification asset. The stepper starts the scanning process of the wafer, physically placing it at any time on the metrology table, as directed by the software. The load port model is responsible for transferring wafers from their storage to the probe table and back. Finally, the automated wafer identification equipment quickly handles incoming distribution cassette (DCs) of wafers, allowing a fast and efficient workflow. TENCOR 6033T also comprises of two optical microscope units, with magnification ranging from 20x to 1000x, capable of imaging defects~ at a nanometer resolution. In addition, the system also include various automated testing station that can quickly assess the electrical properties such as carrier mobility, dielectric constant, open and short circuit testing, resistances, and capacitance of the individual die. For analysis control purpose, the unit employs a range of SoftGUIDES, a software platform with powerful advanced features such as automated die/partition selection, track jump measurement for tracking, and camera for visualization and placement. 6033T wafer testing and metrology machine works as a complete package providing comprehensive electrical, optical and dimensional measurements on various sizes of wafers. It performs efficient scanning of through-holes, trenches, bumps, vias and other elements of the wafer surface with nanometer accuracy, and its automated testing station provides an optimal solution for verification of vital electrical parameters. The tool is capable of providing quick and accurate results for the production of high-reliability devices.