Used ASM AB 339 #9069892 for sale

ASM AB 339 is a fully automated bonder specifically designed for the assembly of complex electronics applications. It offers unparalleled accuracy and reliability, ensuring high quality assemblies with minimal labour requirements. It is ideal for assembling intricate Printed Circuit Board Assemblies (PCBAs) such as mobile phones, tablets, and other electronic systems. ASM AB339 bonder operates through a set of software-controlled processes to affix components of an electrical circuit. This includes thermocompression bonding, thermosonic bonding, wedge-wire wire bonding and direct die-attach tools. The user can set up tool parameters, adjust machine settings, initiate bonding operations and monitor performance, via a web-based graphical user interface (GUI). The system supports a full range of production process parameters such as bonding force, pre-heat, DwellTime, and Pressure profile. The machine also has a real-time monitoring system that helps to improves product quality and ensures optimized bonding. This bonder includes automated vision-assisted processes to accurately assess proper placement and installation of components. The machine is also capable of handling components of different sizes, shapes and orientations. The automatic vision-based inspection technology also helps to detect misalignments, missing components and other possible defects during bonding process. AB 339 bonder comes with a comprehensive tool Library which enables it to store the parameters of all the installed tools, loading them quickly and accurately. The tool library includes all the necessary information, such as algorithm parameters, bond force, pressure time and temperature for each tool. It can also handle complex bonding operations and offer different selectable reflow and curing processes. The bonder is also equipped with a Thermal Profiling System that provides immediate feedback regarding the heating state of each individual chip/die/component during each bonding cycle as well as the ability to provide high-precision quality control. It can also provide process improvements through thermal profiling data which can be used to fine-tune the thermal profile and optimize the assembly efficiency. Overall, AB339 bonder is an efficient and reliable solution that helps reduce assembly time and cost in the production of complex electronics applications.