Used ASM AB 339 #9299483 for sale

ASM AB 339 is an advanced bonder designed for the needs of modern electronics and packaging. This advanced bonder features unique technology that allows it to quickly and accurately bond a wide variety of materials together with little or no manual adjustment. ASM AB339 is capable of bonding wires, ceramic substrates, semiconductors, ceramics, and metals together with a precision of 99% or better. AB 339 uses advanced material selection and thermal management technology in order to ensure that the bond is strong and consistent. The bonder incorporates a dual stage heat process which optimally meets the exact process needs for each particular assembly. This ensures that all heat is delivered with precise control and accuracy. AB339 is also fully automated. This is made possible through the use of motion control technology which enables the operation of the bonder from a central interface. This offers a high level of flexibility and control over the bond process. The bonder is also designed to monitor the entire process in real time, ensuring that all bond parameters are met to the highest standards. The power of ASM AB 339 bonder is further enhanced by the use of advanced imaging and diagnostic tools. These tools allow the user to track the bond progress and ensure that all parameters are met. The diagnostics also allow the user to monitor the health of the bonder and make any necessary adjustments. ASM AB339 bonder is a highly advanced machine that is designed to meet the needs of modern electronics and packaging. It offers great flexibility and accuracy in bonding a wide variety of materials together. It is easy to use and is highly reliable. The added diagnostics and imaging features allow the user to track the progress of the bond and make any necessary adjustments. This makes it an indispensable tool for any electronics or packaging industry.