Used ASM AB 339 #9299510 for sale

ASM AB 339
Manufacturer
ASM
Model
AB 339
ID: 9299510
Vintage: 1999
Gold wire ball bonder 1999 vintage.
ASM AB 339 is a bonder designed for advanced surface mount technology (ASM) assembly. It is a fully automated machine used to bond a variety of surface mount components without sacrificing any production throughput. It has an integrated four-axis pick-and-place equipment that can handle a wide variety of parts from 0201s up to 18 x 18mm in size. The machine is also capable of handling both lead-free and tin/lead solders. ASM AB339 offers high accuracy and repeatability, as well as fast changeover times and an advanced user interface. A Vision System enables it to detect component polarities, package shapes, and solder paste height for improved assembly accuracy. The machine is also equipped with a special high-speed chip handling unit that enables it to bond and handle a wide array of components. The machine also features a powerful soldering process controller that provides high-precision temperature control of up to 500°C. This helps to ensure that components are correctly soldered to the PCB. Additionally, the machine features advanced soldering parameters and preprogrammed profiles for a variety of solders, representing a major timesaving benefit in terms of set up times. AB 339 also has a flexible product-handling capability, with three product placement methods: chip-to-PCB, bulk-to-PCB, and inline-to-PCB. Its integrated nozzle machine optimizes the pre-feeding of components for flexible production runs, and its auto-cleaning feature helps to maintain the machine's high-performance rate. To sum up, AB339 is a highly advanced, fully automated bonder designed for advanced surface mount technology assembly. It has a versatile four-axis pick-and-place tool that can handle a wide variety of parts and packages, and a powerful soldering process controller that provides precision temperature control. In addition, the machine has a flexible product-handling capability and a special high-speed chip handling asset for efficient production runs.
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