Used ASM AD 830 #9221708 for sale

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Manufacturer
ASM
Model
AD 830
ID: 9221708
Wafer Size: 8"
Vintage: 2010
Die bonder, 8" System accuracy: Die placement X-Y: ±1.5 mil (± 38.1 µm) @ 3σ Die rotation: ±3°@ 3σ (For die size >40mil) Machine cycle time: 200 mins Material handling capability: Die size: 6x6 ~ 200x200mil (150 x 150 ~ 5080 x 5080 mm) Lead frame size: Length: 3.15"~10.24" (80 ~ 260 mm) Width: 0.71"~3.15" (18 ~ 80 mm) Height: 2.68"~7.48" (68 ~ 190 mm) Bond head: X-Resolution: 0.007 mil (0.2 µm) Y-Resolution: 0.02 mil (0.5 µm) Z-Resolution: 0.02 mil (0.5 µm) Vision system: PR System: 256 Grey levels Resolution: 480 x 480 Pixel PR Accuracy: ± 1/4 pixel (±1 µm @ FOV 2mm) Angle accuracy: ±0.1° Work holder: Track width: 0.5"~2.95" (12.7 ~ 75mm) Wafer table: Auto alignment: ±10° Range, 0.001875°/ Step Facilities requirements: Voltage: 110 / 200 / 220 / 240 VAC Frequency: 50/60 Hz Compressed air: Minimum 5 bar (71 PSI) Power consumption: 2500 W 2010 vintage.
ASM AD 830 is a robust, precision die attacher designed to provide accurate and repeatable attachment of dies onto integrated circuits. The equipment is available in a benchtop or an inline configuration and supports die sizes up to 8 mm square. The system utilizes a direct imaging technology, allowing for precision placement of dies into a detailed image that is stored in memory. This pre-programmed memory is combined with a precise manipulation of the die by a reliable pick-and-place unit, resulting in a repeatable die attachment process. The integrated microscope ensures accurate viewing of the die and the flatness of the IC, providing superb detail and accuracy. ASM AD830 is PC-driven software-controlled, enabling quick and easy setup and operation. Its user-friendly software interface supports a wide range of parameters, including die type, size, and position. Parameters can easily be changed and modified for special needs. AD 830 is ideal for applications requiring high yield and cycle time, as well as for a wide range of substrates including gallium arsenide, silicon, and metal. It features adaptive alignment, which compensates for variation in substrate thickness, providing better and repeatable die attachment. Additionally, its precision vision systems and servo control tools allow for precise and repeatable die placement. AD830 has built-in safety features, including a vision- and sensor-based component detection machine, which help protect against component damage. Furthermore, the tool is capable of automatically cleaning the substrates prior to die attachment and can then proceed to the next attachment task after the die is placed. ASM AD 830 is the ideal machine for precise and reliable die attachment, provideding the operator with an efficient and user friendly die attachment task.
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