Used ESEC 3006 F/X #293586215 for sale

Manufacturer
ESEC
Model
3006 F/X
ID: 293586215
Wire bonder.
ESEC 3006 F/X is a robust, cost-effective bonding solution for high volume, precision manufacturing needs. This reliable and efficient equipment uses a technology called coplanarity to produce accurate, high-quality bond connections that are effective in high temperatures and harsh environments. ESEC 3006 F/X is an automated, turn-key bonding solution that has no need for operator involvement during production. The system is designed to quickly and accurately bond a variety of components including surface mount, lead through hole, conductive films and rigid flex devices. This versatility makes the unit suitable for medical, automotive, telecommunications, consumer electronics and industrial automation applications. ESEC 3006 F/X can be used with a variety of materials such as various metals, plastics, and glass. It features an intuitive user interface and can be programmed to bond with and without flux. This allows for more flexibility and control of the bonding process. ESEC 3006 F/X utilizes a patented coplanarity technology, which ensures accuracy and precision when bonding components. ESEC 3006 F/X is designed to provide high-reliability bonding of an array of sizes and configurations and will meet most production capacity needs. This machine has a fast, efficient, and reliable heat-sensitive bond process that ensures the highest possible quality control. The tool also features an automatic feeder, which greatly reduces cycle time and improves productivity. ESEC 3006 F/X is capable of bonding both rigid and flexible components. This asset allows for complete traceability of each connection and has safety features that protect operators. The model also offers the flexibility to include both thermal and ultrasonic bonding methods, and can be validated for ESD and equipment reliability through manufacturing tests. ESEC 3006 F/X is a reliable and cost-effective solution for high-volume, precision manufacturing. This system is designed to provide accurate and precise bonding connections and is perfect for a variety of applications. This unit is suitable for a number of industries, ensuring efficient and safe production, and improved control of the bonding process.
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