Used MEYER BURGER TS 23 #9209254 for sale

MEYER BURGER TS 23 is a crystal growing, sawing and slicing equipment used for various types of monocrystalline and polycrystalline silicon materials. This system is designed to efficiently manufacture high-quality silicon wafers for the semiconductor industry. It provides a cleanroom compatible solution to grow, saw and slice large crystal blocks into the desired sizes. The unit allows for the automatic production of high-precision, thin-film solar wafers with a thickness of 200 to 350 mu m and a diameter of 150 to 200 mm. MEYER BURGER TS23 consists of a crystal pulling unit, a gas handling unit, a furnace, a single- or multi-axis slicing unit and a saw unit. The crystal pulling unit is fully automated and enables the creation of homogeneous and uniform crystal blocks with a purity which may be higher than 99.995 %. The gas handling unit of TS-23 supplies the necessary components for the silicon furnace to reach the optimal growth conditions. This machine enables the effective filtration of any foreign particles, the cooling of the ampoule before or after the growth process and the application of pressure to control the temperature distribution in the ampoule. The furnace supplied with TS23 is suitable for dealing with different capacities of ingots in varying widths, weights and shapes. Inside the furnace, a heat flux is applied at a precise rate to control the growth process of the silicon. The furnace is designed to save energy and has CryoCool™ technology to help maintain an optimal temperature. Once the ingot size has been determined, TS 23 is outfitted with the single- or multi-axis slicing unit. This unit is specifically designed to slice the ingot with high precision. It is ideal for making thin-film and thick-film solar wafers with a diameter of between 150 and 200 mm. Finally, the saw unit is used to cut the thin-film solar wafers into the desired sizes. This saw unit is designed for excellent sample handling in a cleanroom compatible environment. MEYER BURGER TS-23 is a comprehensive crystal growing, sawing and slicing unit that is suitable for producing high-precision thin-film solar wafers for the semiconductor industry. With its automated processes and new CryoCool™ technology, this tool is able to deliver efficient operations and superior results.