Used ASM AD 838 #9122569 for sale

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ASM AD 838
Sold
Manufacturer
ASM
Model
AD 838
ID: 9122569
Wafer Size: 6", 8", 12"
Vintage: 2012
Die bonders, 6"-12" Currently warehoused 2012 vintage.
ASM AD 838 is a die attacher that is widely used in the semiconductor and electronic industries for rapid wire bonding and attaching and interconnecting of dies. The device features an advanced, fully automated setup and delivers fully integrated compatibility with robotic systems. ASM AD838 features a dual head configuration which allows for simultaneous attachment of two dies per cycle. The device comes equipped with a tilting and rotating mechanism, allowing the user to accurately refer to x, y or z coordinates for precise location of the bonding area. The bonding process is controlled via a galvanometer head which is manually steered by the user, allowing for maximum versatility when connecting device components. The device features an integrated vision system that allows for accurate placement of dies on the desired surface. The imaging system helps to reduce errors by accurately locating attachment targets and assessing bonding quality. In addition, the device also offers integrated automatic die-to-die alignment, enabling users to precisely adjust the die position while on the processing substrate. AD 838 also offers automatic die positioning capabilities, enabling the device to accurately determine the thickness of the substrate and optimize the wire loop size based on the required shear force. The device comes with a large control console that allows users to input specific programs for automated operation. The device also features an integrated die library, which enables users to program specific die sizes and characteristics to the individually programmable units. AD838 is a user friendly device that is easy to operate, requires minimal user intervention, and is designed to be robust and reliable. The device can be continuously operated for several hours due to the product's low power consumption, and it has the ability to diagnose faults and operations, as well as automatically adjust settings for optimal performance. The device is highly repeatable and compliant with a wide variety of substrates, allowing it to be used in a range of different applications.
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